MediaTek and TSMC have reportedly joined forces to develop the Dimensity 9400, the company’s upcoming 3nm System-on-Chip (SoC). Building on their successful partnership in creating the 3nm SoC, which boasts a remarkable 32 percent improvement in power efficiency compared to its predecessors, both companies are gearing up for the launch of their first joint product.
While the exact name of the chipset has not been officially confirmed, speculation points towards it being named the Dimensity 9400. MediaTek’s CEO, Rick Tsai, recently shed light on this collaboration, emphasizing the strategic alliance’s focus on optimizing efficiency for the upcoming chipset. With the absence of low-power cores similar to the Dimensity 9300, the partnership aims to address potential power draw challenges, possibly leveraging AI and neural cores for specific tasks.
The collaboration for the 3nm Dimensity 9400 reportedly goes beyond just the fabrication
As MediaTek and TSMC extend collaboration on ultra-low power technology, industry insiders anticipate a significant improvement in performance and, especially, power efficiency. The upcoming 3nm SoC from MediaTek will hopefully continue its success trajectory, with the Dimensity 9300 already acclaimed as the most powerful smartphone chipset currently available.
CEO Rick Tsai’s optimistic outlook for 2024 underscores the impact of the artificial intelligence (AI) boom on MediaTek’s fortunes. With MediaTek offering chips tailored for the AI category, next year promises to be a positive turning point for the company.
Rumors surrounding the 3nm Dimensity 9400 suggest a CPU cluster configuration featuring a Cortex-X5 paired with an unnamed CPU design, ensuring unparalleled multi-core performance. Despite the absence of efficiency cores in the Dimensity 9400, a close-knit collaboration between TSMC and MediaTek may mitigate potential power draw challenges. However, Qualcomm will also adopt TSMC’s 3nm fabrication process and may even go for a deeper collaboration like MediaTek as well.
As the race for superior silicon intensifies, both MediaTek and Qualcomm will introduce their cutting-edge SoCs in the coming year, setting the stage for an intriguing showdown in the world of mobile chipsets.
2023-12-28 15:08:41