A new report has revealed more details about the Dimensity 9400 chipset, MediaTek’s next flagship SoC. It aims to continue competing against Qualcomm’s most powerful mobile hardware, as has been happening in recent years. It is expected to be a worthy rival for the future Snapdragon 8 Gen 4.
According to Digital Chat Station on Weibo, the Dimensity 9400 chipset is identified with the model number MT6991. In addition, it will be manufactured in TSMC factories using the Taiwanese company’s second-generation 3nm N3E process. This will guarantee both high performance and good energy efficiency. In fact, this TSMC manufacturing node is said to reduce power consumption by up to 34% compared to the previous generation.
The jump to a 3nm node will be one of the big improvements in the SoC. The company’s latest flagship chips had been produced in 4nm nodes. Other big names in the segment, such as Qualcomm and Samsung, will also launch their first 3nm flagship chips later this year.
The Dimensity 9400 CPU architecture rules out “efficiency cores”
Coming back to the MediaTek Dimensity 9400 details, the report claims that it will maintain the “1 + 3 + 4” CPU structure of its predecessor, the Dimensity 9300/9300+. That means there is 1 Cortex-X5 super core that is currently being tested at 3,4 GHz. There are also 3 Cortex-X4 cores and 4 Cortex-A720 cores of unknown frequency. So, the company once again discarded the Cortex-A5xx series of cores designed for energy efficiency. Qualcomm is said to be making a similar change to its Snapdragon 8 Gen 4. The latter will even use custom Oryon cores.
Early benchmarks of the Dimensity 9400 had previously been leaked. In these, the Mediatek chip was a bit above the Snapdragon 8 Gen 4. However, things may change once the final product is released. The next Dimensity flagship SoC is said to be launched in October. Taking into account the background, Qualcomm would also launch its next, more powerful Snapdragon in the same month.
2024-05-30 15:09:40