The Taiwanese chip manufacturer, MediaTek, is reportedly all set for an early launch of the flagship Dimensity 9400 chipset. Earlier this month, MediaTek’s CEO hinted that the company’s next flagship chipset will challenge the Snapdragon 8 Gen 4 scheduled to launch in October. Based on the CEO’s statement and Snapdragon’s next flagship chip launch timeline, there were speculations about the October launch of the MediaTek Dimensity 9400. Now, it seems we may have a more precise launch timeline for the chipset.
MediaTek is reportedly eyeing the mid-October launch of its next flagship chipset, Dimensity 9400
A reliable Chinese tipster Digital Chat Station recently made claims about the early launch of the MediaTek Dimensity 9400 chipset. Per the tipster’s last Saturday Weibo post, MediaTek is eyeing to launch the high-end SoC around mid-October. It’s kind of a surprise since MediaTek has been launching its high-end processors in the last quarter of the year. But again, with the release date of Snapdragon 8 Gen 4 on the card, the early launch of Dimensity 9400 makes sense.
The tipster also adds that smartphones with Snapdragon 8 Gen 4 might debut in the market in November or December. Also, a mid-range Snapdragon 8 Gen 3 phone is reportedly in the works and could launch around the same timeline. However, there’s no mention of a specific name or model of the device in the tipster’s post.
Digital Chat Station also adds that a smartphone with MediaTek Dimensity 8400 might also launch around the same timeline. That too, in a lower price range to compete with the alleged Snapdragon 8 Gen 3 phone.
Previous leaks give some idea about the performance of the chipset
Worth noting that the leak about the launch of Dimensity 9400 is in line with other reports hinting early arrival of the Vivo X200 series or Oppo Find X8 series. Both the phones are expected to launch ahead of the Xiaomi 15 series which would reportedly be the first phone to feature the Snapdragon 8 Gen 4 chipset.
That said, we can’t confirm the exact launch date of the Dimensity 9400. However, we may have some details about the chipset. According to previous leaks, the Dimensity 9400 will be built on TSMC’s second-generation 3nm process.
Besides, it could be the first chip to use Samsung’s industry-leading 10.7 Gbps LPDDR5x memory. It will allegedly offer a 30% CPU performance boost while consuming 30% less power than the Snapdragon 8 Gen 3. Moreover, it could offer a 40% boost in NPU (Neural Processing Unit) processing over the last year’s chip.
2024-08-26 15:07:18